MediaTek’s new Dimensity 8300 will bring in a new generation of generative AI innovation powered by high-performance, very power-efficient chipsets in high-end smartphones.
MediaTek's New Dimensity 8300
The new Dimensity 8300, an energy-efficient processor intended for high-end 5G devices, was unveiled by MediaTek today. This chipset, which is the newest member of the Dimensity 8000 family of SoCs, brings flagship-caliber experiences to the premium 5G smartphone market with its low power consumption, adaptive gaming technology, and powerful connection.
The chipser is an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s most recent v9 CPU architecture. It is based on TSMC’s 2nd generation 4nm technology. In comparison to the previous generation chipset, the new Dimensity 8300 delivers 30% peak power efficiency benefits and 20% quicker CPU performance thanks to its strong core configuration.
Furthermore, the Mali-G615 MC6 GPU update for the new Dimensity 8300 offers up to 60% more performance and 55% better power efficiency. Also, users may take advantage of responsive and exciting experiences in gaming, lifestyle apps, photography, and other areas thanks to the chipset’s remarkable memory and storage capabilities.
Dr. Yenchi Lee, the Deputy General Manager of MediaTek’s Wireless Communications Business Unit, said that, “With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to pick and choose between accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities—they can have it all.” He added, “the Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency.”
Thanks to the APU 780 AI processor included inside the chipset, the MediaTek’s new Dimensity 8300 is the first premium-tier SoC with complete generative AI capabilities. As a result, this new Dimensity 8300 may assist developers in creating cutting-edge applications that take advantage of steady diffusion and large language models (LLMs) up to 10B.
Using the same architecture as the flagship of the new Dimensity 9300 SoC, the APU 780 outperforms the Dimensity 8200 by 3.3 times in AI performance and by 2 times in INT and FP16 calculation. These AI powers, along with MediaTek’s 14-bit HDR-ISP Imagiq 980, will raise the standard for high-end smartphone photography and videography. Because of the Dimensity 8300’s incredibly power-efficient design, users will be able to record for extended periods of time and take more detailed, clearer films in 4K60 HDR.
MediaTek’s newest generation of HyperEngine adaptive gaming technology delivers sophisticated power efficiency optimizations to better maximize battery life. Utilizing unique performance algorithms, the Dimensity 8300 adjusts intelligently to processing needs and keeps track of device temperature. This keeps devices cool and maximizes playability, enabling users to experience smooth rendering, minimum delay, and full frame rate.
With an integrated 3GPP Release-16 standard 5G modem that makes use of scenario-specific optimizations to boost connectivity in areas with poorer connections, the Dimensity 8300 offers blazingly fast speeds. These enhancements boost the sub-6 GHz range and performance to provide a more dependable connected experience. The modem has a downlink speed of up to 5.17 Gbps and enables 3CC carrier aggregation.
Among the MediaTek Dimensity 8300’s other interesting features are:
- Compared to the Dimensity 8300’s predecessor, LP5x 8533Mbps and uFS4.0 MCQ memory offer a 33% performance gain on LPDDR and up to 100% quicker R/W to flash.
- When compared to the previous generation, MediaTek 5G UltraSave 3.0+ increases 5G power efficiency by up to 20% in situations of everyday usage.
- Wi-Fi/Bluetooth hybrid coexistence technology and enhanced Wi-Fi 6E performance with 160 MHz bandwidth allow accessories such as wireless gamepads and earphones to function flawlessly together.
- Device manufacturers may produce outstanding smartphones that differentiate themselves from rivals in distinctive ways thanks to Dimensity 5G Open Resource Architecture (DORA).
Dimensity 8300 will power 5G devices that will be available on the worldwide market by the end of 2023. Please visit https://i.mediatek.com/mediatek-5g to learn more about MediaTek’s Dimensity portfolio.
