MediaTek debuts Dimensity 6000 series
The Dimensity 6100+ SoC offers premium features at an affordable price point, such as remarkable power efficiency, vivid displays, high frame rates, AI-powered camera technologies, industry-leading low power consumption, and reliable Sub-6 5G connection.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
“The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.” Chen added.
Using MediaTek UltraSave 3.0+ technology, the Dimensity 6100+ includes an improved 5G modem that supports the 3GPP Release 16 standard and up to 140MHz 2CC 5G Carrier Aggregation while also dramatically decreasing power consumption.
With its two Arm Cortex-A76 large cores and six Arm Cortex-A55 efficiency cores, this chip offers several noteworthy improvements, such as support for 10-bit displays, 10-megapixel cameras, great UX and GPU performance, and a wealth of peripheral functions.
The Dimensity 6100+ chipset also has the following key features:
- Up to 108MP Non-ZSL camera support.
- Up to 2K 30fps video capture.
- In comparison to competing technologies, UltraSave 3.0+ technology promises a 20% reduction in 5G power usage.
- Strong camera capabilities, including AI-bokeh for beautiful photos and selfies; in partnership with Arcsoft, MediaTek is also introducing AI-color technologies to popular smartphones so users can express their creativity.
- Support for premium 10-bit displays reproduces more than one billion colors for vivid pictures and movies and supports frame speeds between 90Hz and 120Hz for a fluid user experience.
To increase the accessibility of fantastic mobile experiences, MediaTek’s comprehensive 5G portfolio expands across several pricing tiers.
The Dimensity 8000 family targets high-end mobile devices, the Dimensity 7000 lineup broadens the company’s selection of high-tech gadgets, and the Dimensity 9000 series is created for flagship smartphones and tablets.
Meanwhile, higher-end features will soon be made available on more affordable 5G smartphones thanks to the new Dimensity 6000 series.
The first smartphones equipped with the Dimensity 6100+ chipset will hit the market in the third quarter of 2023.