MediaTek just announced its new Dimensity 9000+, the company’s latest top-of-the-line 5G
smartphone chipset.
MediaTek’s new flagship chipset
This new high-end solution outperforms the Dimensity 9000 in terms of performance, making the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ SoC combines Arm’s v9 CPU architecture with a 4nm octa-core technology.
It integrates one ultra-Cortex-X2 core running at up to 3.2GHz, three super Cortex-A710 cores, and four efficiency Cortex-A510 cores. Its powerful CPU architecture and Arm Mali-G710 MC10 graphics processor enhance CPU performance by more than 5% and GPU performance by more than 10%.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
Moreover, the integratedLPDDR5X RAM enables 8MB L3 CPU cache and 6MB system cache. It also incorporates MediaTek’s fifth-generation Application Processor Unit (APU 5.0) for advanced AI computing capabilities in a power-efficient architecture.
The MediaTek Dimensity 9000+ has the following key features:
- MediaTek Imagiq 790: The flagship 18-bit HDR-ISP provides 320MP and concurrent triple camera 18-bit HDR video recording. The powerful 9Gpixel/s ISP also supports 4K HDR Video + AI noise reduction, allowing for the best results even in low-light situations.
Leading 3GPP Release-16 5G Modem: For increased efficiency, the chipset also has 5G/4G Dual SIM Dual Active compatibility and MediaTek’s 5G UltraSave 2.0 power-saving improvement suite. Using 3CC Carrier Aggregation (300MHz), the integrated 5G modem boosts sub-6GHz speed up to 7Gbps downlink and enables R16 UL improvement.
Wi-Fi 6E, New GNSS with Beidou III-B1C, and New Bluetooth 5.3: Smartphone users may experience smooth communication because of the chip’s compatibility with the most recent Wi-Fi, Bluetooth, and GNSS standards.
MediaTek MiraVision 790: The Dimensity 9000+ supports the most recent 144Hz WQHD+ displays as well as super-fast 180Hz FullHD+ panels. This is while optimizing power consumption with MediaTek’s Intelligent Display Sync 2.0 technology. Plus, MediaTek’s newest Wi-Fi Display technology can handle up to 4K60 HDR10+ video.
“With a suite of top-tier AI, gaming, multimedia, imaging, and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming, and an all-around better user experience.” he added.
The Dimensity 9000+ is the latest addition to the Dimensity 9000 family of flagship smartphone chipsets. They designed it to meet the mobile market’s expanding bandwidth demands. Smartphones with this new flagship chipset will be available in the third quarter of this year.
