At CES 2023, MediaTek, one of the early adopters of Wi-Fi 7 technology, will debut a complete ecosystem of production-ready products using the newest wireless connectivity technology. The newly announced Genio 700 chipset will also be featured as part of a demo at MediaTek’s booth at CES 2023.
MediaTek Global Ecosystem of consumer-ready Wi-Fi 7 products
The culmination of MediaTek’s investment in Wi-Fi 7 technology, these products emphasize dependable and always-on connected experiences across a wide range of devices in several product categories, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.
Wi-Fi 7 is the most recent and potent Wi-Fi standard, and it significantly enhances user experience by using a record-breaking 320MHz channel bandwidth and 4096-QAM modulation.
For time-consuming applications, Multi-Link Operation (MLO) allows the Wi-Fi connection to aggregate channel speeds and reduce link disruption in crowded environments.
“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honored to now show the significant progress we have made in building a more complete ecosystem of products,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek.
“This lineup of devices, many of which are powered by the CES 2023 Innovation Award-winning Filogic 880 flagship chipset, illustrates our commitment to providing the best wireless connectivity.” he added.
When compared to competing options, MediaTek’s Wi-Fi 7 offering uses a 6nm process to deliver a 50% reduction in primary power usage, a 25x reduction in CPU use, and a 100x shorter MLO switch latency. To address a bigger service area and more connected devices, 4T5R and penta-band mesh are also provided.
Moreover, the devices on a demonstration this week use MediaTek’s newest Filogic chips, which combine Wi-Fi 7 access point technology for broadband operators, retail router channels, and enterprise markets, and the Filogic 380 chipset, designed to bring Wi-Fi 7 connectivity to all client devices, including smartphones, tablets, laptops, TVs, and streaming devices.
MediaTek Genio 700: Chipset for industrial and smart home products
Additionally, MediaTek unveiled the octa-core Genio 700 chipset for the Genio platform for the Internet of Things devices, which is intended for smart homes, smart retail, and industrial IoT solutions. This new chipset will be demonstrated at MediaTek’s booth at CES 2023.
The MediaTek Genio 700 is an N6 (6nm) IoT chipset with a focus on power efficiency. It has two ARM A78 cores operating at 2.2GHz and six ARM A55 cores at 2.0GHz, as well as a 4.0 TOPs AI accelerator. It includes an ISP for improved images as well as compatibility with FHD60+4K60 displays.
“When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding,” said Richard Lu, Vice President of MediaTek IoT Business Unit.
“With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers.” he added.
Designers may modify products using Yocto Linux, Ubuntu, and Android thanks to the Genio 700 SDK. Regardless of the type of application, customers may easily and quickly develop their own products with this support.
MediaTek Genio 700 features:
- Supports high-speed interfaces, including PCIe 2.0, USB 3.2 Gen1, and MIPI-CSI interface for camera
- Dual Display support FHD60+4K60 with AV1, VP9, H.265, and H.264 (video decode) support
- Support for industrial grade design and wide temp with 10 years of longevity
- ARM SystemReady certification for providing a standard and easy way to integrate the platform
- ARM PSA certification for increased security