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    Home»Tech News»MediaTek just launched the latest Dimensity 9000 flagship chipset
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    MediaTek just launched the latest Dimensity 9000 flagship chipset

    Dante BisaisBy Dante BisaisNovember 19, 2021Updated:April 21, 20222 Mins Read
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    Dimensity 9000
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    MediaTek held its annual MediaTek Executive Summit 2021 today and unveiled new products including its new flagship Dimensity 9000.

    Dimensity 900
    MediaTek’s latest flagship chipset

    The latest MediaTek Dimensity 9000 is the world’s first TSMC 4nm-class smartphone chip. It is also the most advanced and power-efficient chip we have today. This chipset uses new armv9 architecture that has one Cortex-X2 ultra-core, three Cortex-A710 super-cores, and four Cortex-A510 efficiency cores. Besides, it already has a very fast LPDDR5x 7500Mbps support for the memory.

    Dimensity 9000 also features the latest Arm Mali-G710 graphics processor and has a new raytracing SDK. That technology will allow developers to bring us exciting enhanced graphics and visuals. It can also support a very fluid display with a 180Hz refresh rate at FullHD+.

    Another amazing feature of this chipset is the 320MP camera support. It also allows you to capture HDR video on three cameras simultaneously, thanks to its flagship 18-bit HDR-ISP.

    This chipset also supports MediaTek’s 5th generation Artificial Intelligence processor. They developed it to achieve the best possible performance in AI-multimedia, AI-gaming, AI-camera, and social video experiences.

    Dimensity 9000

    When it comes to connectivity, it comes with 3GPP Release-16 standard technology. It is also the first chipset to have 3CC Carrier Aggregation (300MHz) that can reach a maximum 7Gbps download speed. In addition, this is the first 5G smartphone modem that supports R16 UL Tx Switching for both SUL and NR UL-CA connections. The modem also significantly reduces power consumption in both active and standby 5G connections.

    Furthermore, it can also give up to 2X better Wi-Fi performance since it now has Wi-Fi 63 2×2 (BW160). With that, expect a smooth experience in gaming, streaming media, and video conferencing. This chipset is also the first to bring Bluetooth 5.3 to the smartphone. Moreover, it also features Bluetooth LE Audio-ready technology with Dual-Link True Wireless Stereo Audio and Beidou III-B1C GNSS.

    Related Articles:
    • MediaTek announces its new Dimensity 920 and Dimensity 810 5G chipsets
    • MediaTek announces its new Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

    Lastly, MediaTek mentioned that the first smartphone that features the Dimensity 9000 will arrive globally in late Q1.

    For more information, just visit the official website of MediaTek.

    5g Dimensity 9000 MediaTek
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    Dante Bisais
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    Dante Bisais is a technology writer and Managing Editor at BALASTECH. He writes about smartphones, gadgets, consumer technology, and the latest developments in the tech industry, bringing a practical perspective to the products and experiences that matter to everyday users.

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