MediaTek launches its latest Dimensity 1300 and Dimensity 8000 5G series for flagship 5G smartphones!
New powerful MediaTek Dimensity chipsets!
The new additions in the Dimensity family are named Dimensity 8000 and Dimensity 8100. Â These new chipsets will offer superior level technology to upcoming flagship 5G smartphones. With that, we can expect them to bring great displays, connectivity, gaming experience, multimedia, and imaging features.
According to MediaTek, they built the new Dimensity 8000 series on the ultra-efficient TSMC 5nm production process with an octa-core CPU. They also mentioned that both chips use cutting-edge technology from MediaTek’s strong flagship Dimensity 9000 platform.
The Dimensity 8100 includes four premium Arm Cortex-A78 cores with speeds up to 2.85GHz. While the Dimensity 8000 includes four Cortex-A78 cores with speeds up to 2.75GHz. Also, both processors feature an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies. This will result in exceptional power efficiency that extends playtime and frame rates. MediaTek claimed that Dimensity 8100 will get 170fps, while 140fps for the Dimensity.
Moreover, this new Dimensity series will also support quad-channel LPDDR5 RAM and UFS 3.1 storage to ensure a very fast data stream.
The features of the Dimensity 8000 5G series chips also include:
- Support for up to 200MP cameras and 4K60 HDR10+ videography.
- MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments for crisp shots with enhanced details.
- Simultaneous dual-camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses – for example, wide + tele – at the same time.
- Leading 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation.
- MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
Support for Wi-Fi 6E and Bluetooth 5.3 for seamless coexistence of Wi-Fi connectivity and Bluetooth peripherals.
MediaTek Dimensity 1300
Furthermore, they also launched the new 6nm Dimensity 1300 processor. This chipset also supports up to 200MP, HyperEngine 5.0, and AI enhancements. It has an Arm Cortex-A78 ultra-core, three Arm Cortex-A78 Super cores, and four Arm Cortex-A55 efficiency cores. Besides, it also has Arm Mali-G77 GPU and MediaTek APU 3.0.
Lastly, we can expect great 5G smartphones featuring these new Dimensity chipsets this first quarter of 2022. The Redmi K50 series, realme GT Neo3, OPPO K10, and an unspecified OnePlus smartphone are among the upcoming phones reported to feature the Dimensity 8000 series chips.
To know more information, just visit the official website of MediaTek.
