MediaTek just launched the new Dimensity 1050 chipset for seamless 5G smartphone connectivity.
The latest Dimensity chipset announced!
This new Dimensity 1050 is their first mmWave 5G chipset that offers seamless connectivity, displays, gaming, and power efficiency. It combines mmWave 5G and sub-6GHz to efficiently transition across network bands. With that, it will deliver the speed and capacity needed to give smartphone users a remarkable experience.
MediaTek built this chipset on the ultra-efficient TSMC 6nm production process with an octa-core processor. It also supports 3CC carrier aggregation on the sub-6 (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum. That means it can deliver up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone.
According to MediaTek, it also offers Wi-Fi optimizations together with HyperEngine 5.0 gaming technology. It will ensure that you have lower-latency connections with the new tri-band 2.4GHz, 5GHz, and 6GHz.
“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands,” said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. “With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makers to differentiate their smartphone product lines.”
Moreover, it also uses two premium Arm Cortex-A78 CPUs with a clock speed of 2.5GHz. For its GPU, it uses the latest Arm Mali-G610 graphics engine. The chipset also supports UFS 3.1 and LPDDR5 memory for ultra-fast data streams.
Other features of Dimensity 1050:
- Support for True Dual 5G SIM (5G SA + 5G SA) and Dual VoNR.
- Super-fast 144Hz Full HD+ displays with intense, vibrant colors through MediaTek’s MiraVision 760.
- Dual HDR video capture engine, enabling users to simultaneously stream with the front and rear cameras.
- Excellent noise reduction for superb low-light photos and MediaTek’s APU 550 improves AI camera actions.
- Wi-Fi 6E support for superior power efficiency and a 2×2 MIMO antenna brings faster, more reliable connections.
MediaTek also announced two new chipsets, the Dimensity 930 and Helio G99. The Dimensity 930 also offers great connectivity and capabilities. Meanwhile, the Helio G99 comes with great gaming performance and better power efficiency compared to its predecessor.
The company mentioned that the Dimensity 930 will be available on the market in the second quarter of the year. While the Dimensity 1050 and Helio G99 will come in the third quarter.
